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US Patent 11527517 Lighting-emitting device filament

Patent 11527517 was granted and assigned to Seoul Semiconductor on December, 2022 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Seoul Semiconductor
Seoul Semiconductor
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11527517
Date of Patent
December 13, 2022
Patent Application Number
17734573
Date Filed
May 2, 2022
Patent Citations
‌
US Patent 11348907 Lighting-emitting device filament
‌
US Patent 10281129 Filament structure of LED light bulb
‌
US Patent 10957675 Lighting-emitting device filament
Patent Primary Examiner
‌
Tracie Y Green
CPC Code
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G02B 7/021
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H04N 5/2253
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H01L 25/0753
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H01L 23/5387
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H01L 23/562
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H01L 33/22
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H01L 33/50
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H01L 33/62
...

A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

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