Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seong Jin Lee0
Jae Hyun Park0
Jong Kook Lee0
Date of Patent
May 31, 2022
0Patent Application Number
171868790
Date Filed
February 26, 2021
0Patent Citations
Patent Citations Received
Patent Primary Examiner
A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.
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