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US Patent 11348907 Lighting-emitting device filament

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
113489070
Patent Inventor Names
Seong Jin Lee0
Jae Hyun Park0
Jong Kook Lee0
Date of Patent
May 31, 2022
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Patent Application Number
171868790
Date Filed
February 26, 2021
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Patent Citations
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US Patent 11073249 Bulb-type light source
0
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US Patent 10309537 Linerless pressure vessel by centrifugal forced weaving and method for manufacturing thereof
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US Patent 10957675 Lighting-emitting device filament
Patent Citations Received
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US Patent 11527517 Lighting-emitting device filament
Patent Primary Examiner
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Tracie Y Green
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CPC Code
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F21K 9/235
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F21Y 2107/70
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F21Y 2107/90
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F21Y 2115/10
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F21V 29/503
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F21V 19/0025
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H05K 2201/09227
0
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H05K 2201/09409
0
...

A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.

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