US Patent 11519946 Packaged current sensor integrated circuit

A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. Each of the input portion and output portion of the primary conductor is exposed from orthogonal sides of the package body. A fault signal may be provided to indicate an overcurrent condition in the integrated current sensor package. The primary current path may be made of a thick lead frame material to reduce the primary current path resistance.