Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael C. Doogue0
Shaun D. Milano0
William P. Taylor0
Date of Patent
June 25, 2019
0Patent Application Number
154473200
Date Filed
March 2, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.
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