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US Patent 11492697 Apparatus for improved anode-cathode ratio for rf chambers

Patent 11492697 was granted and assigned to Applied Materials on November, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent

Patent attributes

Patent Applicant
Applied Materials
Applied Materials
Current Assignee
Applied Materials
Applied Materials
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11492697
Date of Patent
November 8, 2022
Patent Application Number
16908344
Date Filed
June 22, 2020
Patent Citations
‌
US Patent 10546733 One-piece process kit shield
Patent Primary Examiner
‌
Rodney G McDonald
CPC Code
‌
H01J 37/32651
‌
H01J 37/34
‌
H01J 37/3447
‌
H01J 37/3441
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C23C 14/564
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C23C 14/34

Embodiments of process kits for use in plasma process chambers are provided herein. In some embodiments, a process kit for use in a process chamber includes an annular body having an upper portion and a lower portion extending downward and radially inward from the upper portion, wherein the annular body includes an inner surface having a first segment that extends downward, a second segment that extends radially outward from the first segment, a third segment that extends downward from the second segment, a fourth segment that extends radially outward from the third segment, a fifth segment that extends downward from the fourth segment, a sixth segment that extends radially inward from the fifth segment, a seventh segment that extends downward from the sixth segment, and an eighth segment that extends radially inward from the seventh segment.

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