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US Patent 11430740 Microelectronic device with embedded die substrate on interposer

Patent 11430740 was granted and assigned to Intel on August, 2022 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
Intel
Intel
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Date Filed
March 29, 2017
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Date of Patent
August 30, 2022
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Patent Applicant
Intel
Intel
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Patent Application Number
16474026
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Patent Citations
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US Patent 10163861 Semiconductor package for thermal dissipation
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US Patent 10068874 Method for direct integration of memory die to logic die without use of thru silicon vias (TSV)
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US Patent 10224272 Semiconductor package including a rewiring layer with an embedded chip
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US Patent 10748870 Tri-layer COWOS structure
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US Patent 10867961 Single layer low cost wafer level packaging for SFF SiP
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US Patent 10916514 Metal-free frame design for silicon bridges for semiconductor packages
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US Patent 10020262 High resolution solder resist material for silicon bridge application
Patent Inventor Names
Kristof Darmawikarta
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Robert L. Sankman
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Sheng Li
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Sri Ranga Sai Boyapati
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Amruthavalli Pallavi Alur
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Islam A. Salama
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Robert Alan May
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11430740
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Patent Primary Examiner
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Ida M. Soward
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CPC Code
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H01L 25/071
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H01L 23/5389
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H01L 23/3128
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H01L 23/5381
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H01L 23/5221
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H01L 24/19
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H01L 24/25
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H01L 24/82
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H01L 25/0652
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H01L 25/0655
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