US Patent 11430740 Microelectronic device with embedded die substrate on interposer
Patent 11430740 was granted and assigned to Intel on August, 2022 by the United States Patent and Trademark Office.
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Patent Inventor Names
Amruthavalli Pallavi Alur0
Islam A. Salama0
Kristof Darmawikarta0
Robert Alan May0
Robert L. Sankman0
Sheng Li0
Sri Ranga Sai Boyapati0
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Patent Number
114307400
Date of Patent
August 30, 2022
0Patent Application Number
164740260
Date Filed
March 29, 2017
0Patent Citations
Patent Primary Examiner
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US Patent 11430740 Microelectronic device with embedded die substrate on interposer
Article
Microelectronic devices with an embedded die substrate on an interposer are described. For example, a microelectronic device includes a substrate housing an embedded die. At least one surface die is retained above a first outermost surface of the substrate. An interposer is retained proximate a second outermost surface of the substrate.
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
11430740
Date of Patent
August 30, 2022
Patent Application Number
16474026
Date Filed
March 29, 2017
Patent Citations
Patent Primary Examiner
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