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US Patent 11380669 Methods of forming microelectronic devices

Patent 11380669 was granted and assigned to Micron Technology on July, 2022 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12089422 Microelectronic devices, and related methods and memory devices
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Patent Citations Received
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US Patent 12080700 Microelectronic devices including control logic regions
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Patent Inventor Names
Kunal R. Parekh0
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Infobox
Is a
Patent
Patent
0
Patent Applicant
Micron Technology
Micron Technology
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Current Assignee
Micron Technology
Micron Technology
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
113806690
Date of Patent
July 5, 2022
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Patent Application Number
169057340
Date Filed
June 18, 2020
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Patent Citations
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US Patent 10283703 Cross-point memory and methods for forming of the same
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US Patent 10381362 Three-dimensional memory device including inverted memory stack structures and methods of making the same
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US Patent 10665580 Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same
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US Patent 10847220 Apparatuses and methods for bi-directional access of crosspoint arrays
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Patent Primary Examiner
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Thao P. Le
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CPC Code
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H01L 25/50
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H01L 27/11582
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 US Patent 11380669 Methods of forming microelectronic devices

Article

A method of forming a microelectronic device comprises forming a source material around substantially an entire periphery of a base material, and removing the source material from lateral sides of the base material while maintaining the source material over an upper surface and a lower surface of the base material. Related methods and base structures for microelectronic devices are also described.

Infobox
Is a
Patent
Patent
Patent applicant
Micron Technology
Micron Technology
Current assignee
Micron Technology
Micron Technology
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11380669
Date of patent
July 5, 2022
Patent application number
16905734
Date Filed
June 18, 2020
Patent citations
‌
US Patent 10283703 Cross-point memory and methods for forming of the same
‌
US Patent 10381362 Three-dimensional memory device including inverted memory stack structures and methods of making the same
‌
US Patent 10665580 Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same
‌
US Patent 10847220 Apparatuses and methods for bi-directional access of crosspoint arrays
Patent primary examiner
‌
Thao P. Le
CPC Code
‌
H01L 25/50
‌
H01L 27/11582

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