US Patent 11362235 Substrate structuring methods

Patent

Applied Materials

Applied Materials

US Patent 10090284 Semiconductor device and method of manufacture

US Patent 10014292 3D semiconductor device and structure

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US Patent 10053359 Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof

US Patent 10211072 Method of reconstituted substrate formation for advanced packaging applications

US Patent 10229827 Method of redistribution layer formation for advanced packaging applications

US Patent 10256180 Package structure and manufacturing method of package structure

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US Patent 10297586 Methods for processing a 3D semiconductor device

United States Patent and Trademark Office

Earl N Taylor

H01L 23/49827

H01L 21/486

Y02E 10/547

H01L 21/6835

H01L 2221/68345

H01L 31/1804

H01L 21/0275

H01L 21/3046

H01L 21/30621

H01L 21/3086