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US Patent 11297739 IT enclosure system and in-series configuration

Patent 11297739 was granted and assigned to Baidu Usa on April, 2022 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
0

Patent attributes

Patent Applicant
Baidu Usa
Baidu Usa
0
Current Assignee
Baidu Usa
Baidu Usa
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
112977390
Patent Inventor Names
Tianyi Gao0
Date of Patent
April 5, 2022
0
Patent Application Number
170299310
Date Filed
September 23, 2020
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Patent Citations
‌
US Patent 10010013 Scalable rack-mount air-to-liquid heat exchanger
‌
US Patent 10455726 Modular cooling
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Patent Primary Examiner
‌
Zachary Pape
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CPC Code
‌
H05K 7/20272
0

According to various embodiments, described herein are systems and methods for designing and configuring cooling systems for server racks in an IT cluster. In one embodiment, a cooling system can include a connection module with fluid loop connections and standard fluid ports, and a number of cooling modules, such as a heat exchanger module, a pump module, and a first bypass module, and a second bypass module. The connection module can use the standard fluid connections and standard ports to connect the cooling modules together to form a complete multiple function cooling unit. The cooling unit can be attached to an IT enclosure via the fluid ports on the connection module, and fluid loops are connected between the IT enclosure and each individual cooling modules. The connection module can be customized including the cooling ports, fluid loop connections to accommodate assembling of different standard cooling modules and corresponding functions.

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