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US Patent 10010013 Scalable rack-mount air-to-liquid heat exchanger

Patent 10010013 was granted and assigned to Dell on June, 2018 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent
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Patent attributes

Patent Applicant
Dell
Dell
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Current Assignee
Dell
Dell
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
100100130
Patent Inventor Names
Travis C. North0
Edmond I. Bailey0
Austin Michael Shelnutt0
Christopher M. Helberg0
Date of Patent
June 26, 2018
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Patent Application Number
150162490
Date Filed
February 4, 2016
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Patent Citations Received
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US Patent 12137536 Systems and methods for autonomously activable redundant cooling of a heat generating component
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US Patent 11297739 IT enclosure system and in-series configuration
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US Patent 11388832 Blind-mate connection design for liquid-cooled electronic racks
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US Patent 11924998 Hybrid immersion cooling system for rack-mounted electronic assemblies
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US Patent 11963331 Fully redundant cooling unit with phase change flow control unit
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US Patent 12120846 Immersion cooling systems for electronic components
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US Patent 12127366 Fan management system
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US Patent 12133361 Rack-based management of leaks in liquid cooled information handling systems
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...
Patent Primary Examiner
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Adam B Dravininkas
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Patent abstract

An Information Handling System (IHS) includes at least one node provisioned with heat-generating components and an air passage that enables air to pass through the node and exit the node as exhaust air. An air-to-liquid heat exchanger (ATLHE) block is placed in a path of the exhaust air. The ATLHE block has an air directing structure, one or more air movers to move the exhaust air through the air directing structure, and an ATLHE. The ATLHE includes a liquid transfer conduit having at least one liquid supply port extending into a heat transfer section, which terminates into at least one liquid return port, the liquid transfer conduit enabling cooling liquid transfer through the ATLHE. A liquid cooling subsystem includes supply and return conduits. The supply conduit is sealably mated to the at least one supply port and the return conduit is sealably mated to the at least one return port.

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