US Patent 11189593 Integrated device package

A package is disclosed. The package can include a package substrate that has an opening, such as a through hole, extending from a top side to a bottom side opposite the top side of the package substrate. The package can also include a component at least partially disposed in the through hole. The component can be an electrical component. The component can be exposed at a bottom surface of the package. The package can include a bonding material that mechanically couples the component and the package substrate.