Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 30, 2021
0Patent Application Number
165704880
Date Filed
September 13, 2019
0Patent Primary Examiner
Patent abstract
A package is disclosed. The package can include a package substrate that has an opening, such as a through hole, extending from a top side to a bottom side opposite the top side of the package substrate. The package can also include a component at least partially disposed in the through hole. The component can be an electrical component. The component can be exposed at a bottom surface of the package. The package can include a bonding material that mechanically couples the component and the package substrate.
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