US Patent 11178750 Multilayer substrate, multilayer substrate array, and transmission/ reception module
Patent 11178750 was granted and assigned to Fujikura on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
Realized is a multilayer substrate and a multilayer substrate array, each of which has a high degree of freedom in a production method. At least part of an outer periphery (51) of a multilayer substrate (100), which includes a wiring provided on an inner layer, is processed so as to have a wave shape.
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Patent Inventor Names
Hideyuki Wada0
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Patent Applicant
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Patent Jurisdiction
Patent Number
111787500
Date of Patent
November 16, 2021
0Patent Application Number
166052750
Date Filed
April 4, 2018
0Official Website
Patent Primary Examiner
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US Patent 11178750 Multilayer substrate, multilayer substrate array, and transmission/ reception module
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11178750
Date of patent
November 16, 2021
Patent application number
16605275
Date Filed
April 4, 2018
Patent primary examiner
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