Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideyuki Wada0
Date of Patent
November 16, 2021
0Patent Application Number
166052750
Date Filed
April 4, 2018
0Patent Primary Examiner
Patent abstract
Realized is a multilayer substrate and a multilayer substrate array, each of which has a high degree of freedom in a production method. At least part of an outer periphery (51) of a multilayer substrate (100), which includes a wiring provided on an inner layer, is processed so as to have a wave shape.
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