US Patent 11177237 Manufacturing method of semiconductor package
Patent 11177237 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 16, 2019
Date of Patent
November 16, 2021
Patent Application Number
16714823
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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