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US Patent 11177237 Manufacturing method of semiconductor package

Patent 11177237 was granted and assigned to Taiwan Semiconductor Manufacturing Company on November, 2021 by the United States Patent and Trademark Office.

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Edits on 12 Dec, 2023
"Add patent abstract"
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Golden AI
edited on 12 Dec, 2023
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Patent abstract

A manufacturing method for semiconductor packages is provided. Chips are provided on a carrier. Through interlayer vias are formed over the carrier to surround the chips. A molding compound is formed over the carrier to partially and laterally encapsulate the chip and the through interlayer vias. The molding compound comprises pits on a top surface thereof. A polymeric molding compound is formed on the molding compound to fill the pits of the molding compound.

Edits on 23 May, 2023
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Golden AI
edited on 23 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1117723700
Edits on 23 Mar, 2023
"Entity importer update"
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Golden AI
edited on 23 Mar, 2023
Infobox
Is a
Patent
Patent
0
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
111772370
Date of Patent
November 16, 2021
0
Patent Application Number
167148230
Date Filed
December 16, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=111772370
Patent Primary Examiner
‌
Nitin Parekh
0
Edits on 24 Sep, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 24 Sep, 2022
Infobox
Is a
Patent
Patent
0
Current Assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
111772370
Date of Patent
November 16, 2021
0
Patent Application Number
167148230
Date Filed
December 16, 2019
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=111772370
Patent Primary Examiner
‌
Nitin Parekh
0
Edits on 19 May, 2022
"Entity importer: add url"
Golden AI profile picture
Golden AI
edited on 19 May, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=11177237
Edits on 19 Nov, 2021
"Created via: Entity Importer"
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Golden AI
created this topic on 19 Nov, 2021
Edits made to:
Infobox (+8 properties)
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 US Patent 11177237 Manufacturing method of semiconductor package

Infobox
Is a
Patent
Patent
Current assignee
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11177237
Date of patent
November 16, 2021
Patent application number
16714823
Date Filed
December 16, 2019
Patent primary examiner
‌
Nitin Parekh

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