US Patent 11172314 Packaging for a MEMS transducer
Patent 11172314 was granted and assigned to Cirrus Logic on November, 2021 by the United States Patent and Trademark Office.
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Patent abstract
The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially through the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.
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Patent Inventor Names
Rkia Achehboune0
Roberto Brioschi0
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Official Website
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
111723140
Date of Patent
November 9, 2021
0Patent Application Number
202003200
Date Filed
March 20, 2020
0Official Website
Patent Primary Examiner
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Edits on 11 Nov, 2021
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US Patent 11172314 Packaging for a MEMS transducer
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11172314
Date of patent
November 9, 2021
Patent application number
20200320
Date Filed
March 20, 2020
Patent primary examiner
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