Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Roberto Brioschi0
Rkia Achehboune0
Date of Patent
November 9, 2021
0Patent Application Number
202003200
Date Filed
March 20, 2020
0Patent Primary Examiner
Patent abstract
The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially through the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.
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