US Patent 11043464 Semiconductor device having upper and lower redistribution layers
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Patent abstract
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate.
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Patent Inventor Names
Doo Hyun Park0
Jong Sik Paek0
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Patent Number
110434640
Date of Patent
June 22, 2021
0Patent Application Number
160441640
Date Filed
July 24, 2018
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US Patent 11043464 Semiconductor device having upper and lower redistribution layers
Infobox
Is a
Patent jurisdiction
Patent number
11043464
Date of patent
June 22, 2021
Patent application number
16044164
Date Filed
July 24, 2018
Patent primary examiner
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