Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Edwin J. Adlam0
Robert Lanzone0
Yung Woo Lee0
Gi Jung Kim0
Jae Ung Lee0
Jin Seong Kim0
Ludovico E. Bancod0
Mi Kyeong Choi0
Date of Patent
December 25, 2018
0Patent Application Number
158716170
Date Filed
January 15, 2018
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
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