Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10163867 Semiconductor package and manufacturing method thereof

Patent 10163867 was granted and assigned to Amkor Technology on December, 2018 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity

All edits

Edits on 12 Jun, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 12 Jun, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 12009312 Semiconductor device package
0
Edits on 21 Mar, 2024
"update inverses"
Golden AI profile picture
Golden AI
edited on 21 Mar, 2024
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11935856 Semiconductor device having a redistribution layer
0
Edits on 13 Dec, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 13 Dec, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11844178 Electronic component
0
Edits on 8 Dec, 2023
"Add patent abstract"
Golden AI profile picture
Golden AI
edited on 8 Dec, 2023
Edits made to:
Article (+277 characters)
Article

Patent abstract

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Edits on 2 Oct, 2023
"Add patent inventor(s)"
Golden AI profile picture
Golden AI
edited on 2 Oct, 2023
Edits made to:
Infobox (+8 properties)
Infobox
Patent Inventor Names
Edwin J. Adlam0
Gi Jung Kim0
Jae Ung Lee0
Jin Seong Kim0
Ludovico E. Bancod0
Mi Kyeong Choi0
Robert Lanzone0
Yung Woo Lee0
Edits on 7 Sep, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 7 Sep, 2023
Edits on 26 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 26 Apr, 2023
Edits on 25 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 25 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 24 Apr, 2023
Edits on 5 Apr, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 5 Apr, 2023
Edits on 30 Mar, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 30 Mar, 2023
Edits on 29 Mar, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 29 Mar, 2023
Edits on 27 Mar, 2023
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 27 Mar, 2023
Edits on 25 Jan, 2023
"update inverses"
Golden AI profile picture
Golden AI
edited on 25 Jan, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11563267 Methods for electromagnetic shielding using an outer cobalt layer
0
Edits on 28 Sep, 2022
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 28 Sep, 2022
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 25 Sep, 2022
Edits on 25 Sep, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 25 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
Amkor Technology
Amkor Technology
0
Current Assignee
Amkor Technology
Amkor Technology
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
101638670
Date of Patent
December 25, 2018
0
Patent Application Number
158716170
Date Filed
January 15, 2018
0
Patent Citations Received
‌
US Patent 10665936 Wireless module and method for manufacturing wireless module
0
‌
US Patent 10714822 Wireless module and method for manufacturing wireless module
0
‌
US Patent 11038267 Apparatus and methods for electromagnetic shielding using an outer cobalt layer
0
‌
US Patent 11043464 Semiconductor device having upper and lower redistribution layers
0
‌
US Patent 11272618 Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits
0
‌
US Patent 11410977 Electronic module for high power applications
0
Patent Primary Examiner
‌
Marvin Payen
0
Edits on 10 Aug, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 10 Aug, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 11410977 Electronic module for high power applications
Edits on 10 Mar, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 10 Mar, 2022
Edits on 12 Feb, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 12 Feb, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 11043464 Semiconductor device having upper and lower redistribution layers

Find more entities like US Patent 10163867 Semiconductor package and manufacturing method thereof

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.