US Patent 10964591 Processes for reducing leakage and improving adhesion
Patent 10964591 was granted and assigned to Taiwan Semiconductor Manufacturing Company on March, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 24, 2019
0
Date of Patent
March 30, 2021
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Patent Applicant
Patent Application Number
16449736
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Patent Inventor Names
Hui-Jung Tsai
0
Chen-Hua Yu
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Yun Chen Hsieh
0
Hung-Jui Kuo
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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