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US Patent 10026704 Semiconductor package and method of forming the same

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Taiwan Semiconductor Manufacturing Company
Taiwan Semiconductor Manufacturing Company
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
100267040
Patent Inventor Names
Hsien-Wei Chen0
Jie Chen0
Chi-Hsi Wu0
Der-Chyang Yeh0
Date of Patent
July 17, 2018
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Patent Application Number
157077000
Date Filed
September 18, 2017
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Patent Citations Received
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US Patent 12020983 Processes for reducing leakage and improving adhesion
0
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US Patent 11545458 Semiconductor package
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US Patent 10886255 Die stack structure, semiconductor package having the same and method of manufacturing the same
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US Patent 10964591 Processes for reducing leakage and improving adhesion
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US Patent 10971470 Semiconductor package
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US Patent 11651994 Processes for reducing leakage and improving adhesion
0
Patent Primary Examiner
‌
David S. Blum
0
Patent abstract

An embodiment is a method including forming a first passive device in a first wafer, forming a first dielectric layer over a first side of the first wafer, forming a first plurality of bond pads in the first dielectric layer, planarizing the first dielectric layer and the first plurality of bond pads to level top surfaces of the first dielectric layer and the first plurality of bond pads with each other, hybrid bonding a first device die to the first dielectric layer and at least some of the first plurality of bond pads, and encapsulating the first device die in a first encapsulant.

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