US Patent 10945339 High-density soft-matter electronics
Patent 10945339 was granted and assigned to Carnegie Mellon University on March, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 9, 2016
Date of Patent
March 9, 2021
Patent Applicant
Patent Application Number
15019786
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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