US Patent 10902886 Memory module with buffered memory packages

A memory module includes a plurality of DRAM packages mounted on a printed circuit board. Each DRAM package includes a control die, stacked array dies, and first and second die interconnects coupling the stacked array dies to the control die. The control die includes data signal conduits coupled to the first die interconnects and control signal conduits coupled to the second die interconnects. The control die is configured to receive control signals, and to control the data signal conduits in accordance with the control signals. Each of the DRAM packages is configurable to communicate a respective set of bits of a data signal between a selected die among the stacked array dies and the data conduits in response to the control signals.