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US Patent 10892187 Method for creating a fully self-aligned via

Patent 10892187 was granted and assigned to Micromaterials, Inc on January, 2021 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
‌
Micromaterials, Inc
Date Filed
May 14, 2019
Date of Patent
January 12, 2021
Patent Applicant
‌
Micromaterials, Inc
Patent Application Number
16411437
Patent Citations
‌
US Patent 10319604 Methods for self-aligned patterning
‌
US Patent 10083834 Methods of forming self-aligned vias
3
‌
US Patent 10319636 Deposition and treatment of films for patterning
4
Patent Inventor Names
Uday Mitra
5
Regina Freed
5
Sanjay Natarajan
5
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10892187
Patent Primary Examiner
‌
Daniel P Shook

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