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US Patent 10892187 Method for creating a fully self-aligned via

Patent 10892187 was granted and assigned to Micromaterials, Inc on January, 2021 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
‌
Micromaterials, Inc
Current Assignee
‌
Micromaterials, Inc
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10892187
Patent Inventor Names
Uday Mitra0
Regina Freed0
Sanjay Natarajan0
Date of Patent
January 12, 2021
Patent Application Number
16411437
Date Filed
May 14, 2019
Patent Citations
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US Patent 10319604 Methods for self-aligned patterning
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US Patent 10083834 Methods of forming self-aligned vias
0
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US Patent 10319636 Deposition and treatment of films for patterning
0
Patent Primary Examiner
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Daniel P Shook
Patent abstract

Apparatuses and methods to provide a fully self-aligned via are described. Some embodiments of the disclosure provide an electronic device having a bridging via between a first metallization and a third metallization layer, the bridging via not contacting a second metallization layers. Methods of providing self-aligned bridging vias are also described.

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