US Patent 10811799 Interconnectable circuit boards adapted for lateral in-plane bending
Patent 10811799 was granted and assigned to Metrospec Technology, Llc on October, 2020 by the United States Patent and Trademark Office.
Currently, there are no issues on this topic.
Find more entities like US Patent 10811799 Interconnectable circuit boards adapted for lateral in-plane bending
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.