US Patent 10811799 Interconnectable circuit boards adapted for lateral in-plane bending
Patent 10811799 was granted and assigned to Metrospec Technology, Llc on October, 2020 by the United States Patent and Trademark Office.
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Patent Number
108117990
Date of Patent
October 20, 2020
0Patent Application Number
162692040
Date Filed
February 6, 2019
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US Patent 10811799 Interconnectable circuit boards adapted for lateral in-plane bending
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10811799
Date of patent
October 20, 2020
Patent application number
16269204
Date Filed
February 6, 2019
Patent primary examiner
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