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US Patent 10790281 Stacked channel structures for MOSFETs

Patent 10790281 was granted and assigned to Intel on September, 2020 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Patent attributes

Patent Applicant

Intel

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

107902810

Date of Patent

September 29, 2020

Patent Application Number

157733250

Date Filed

December 3, 2015

Patent Citations Received

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US Patent 11854894 Integrated circuit device structures and double-sided electrical testing

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US Patent 11430814 Metallization structures for stacked device connectivity and their methods of fabrication

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US Patent 11869894 Metallization structures for stacked device connectivity and their methods of fabrication

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US Patent 11869890 Stacked transistors with contact last

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US Patent 11664656 ESD protection for integrated circuit devices

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US Patent 11688780 Deep source and drain for transistor structures with back-side contact metallization

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US Patent 11368016 ESD protection for integrated circuit devices

Patent Primary Examiner

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Ermias T Woldegeorgis

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