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US Patent 10784203 Semiconductor package and method

Patent 10784203 was granted and assigned to Taiwan Semiconductor Manufacturing Company on September, 2020 by the United States Patent and Trademark Office.

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Patent

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Patent Applicant

Taiwan Semiconductor Manufacturing Company

Current Assignee

Taiwan Semiconductor Manufacturing Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10784203

Date of Patent

September 22, 2020

Patent Application Number

15907869

Date Filed

February 28, 2018

Patent Citations

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US Patent 10361167 Electronic assembly using bismuth-rich solder

Patent Citations Received

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US Patent 11942417 Sensor package and method

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US Patent 11508665 Packages with thick RDLs and thin RDLs stacked alternatingly

Patent Primary Examiner

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Erik Kielin

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