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US Patent 10777489 Semiconductor module

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
October 16, 2018
Date of Patent
September 15, 2020
Patent Application Number
16162018
Patent Citations
‌
US Patent 10104775 Semiconductor device and method for manufacturing the same
‌
US Patent 10515880 Lead frame with bendable leads
0
‌
US Patent 10083866 Sawn leadless package having wettable flank leads
0
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US Patent 10340208 Semiconductor device
Patent Citations Received
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US Patent 10998256 High voltage semiconductor device lead frame and method of fabrication
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10777489
Patent Primary Examiner
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David A Zarneke

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