US Patent 10340208 Semiconductor device

A semiconductor device includes a semiconductor element, a lead on which the semiconductor element is mounted, a bonding member fixing the semiconductor element to the lead, and a resin package enclosing the semiconductor element and a portion of the lead. This lead is formed with a groove recessed at a location spaced from the semiconductor element. The groove has first and second inner surfaces, where the first inner surface is closer to the semiconductor element than is the second inner surface. The angle the first inner surface forms with respect to the thickness direction of the semiconductor element is smaller than the angle the second inner surface forms with respect to the thickness direction.