US Patent 10768385 High density fiber enclosure and method
Patent 10768385 was granted and assigned to Panduit (company) on September, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 7, 2019
0
Date of Patent
September 8, 2020
0
Patent Applicant
Patent Application Number
16434411
0
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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