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US Patent 10768385 High density fiber enclosure and method

Patent 10768385 was granted and assigned to Panduit (company) on September, 2020 by the United States Patent and Trademark Office.

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Patent

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Patent Applicant

Panduit (company)

Current Assignee

Panduit (company)

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

107683850

Date of Patent

September 8, 2020

Patent Application Number

164344110

Date Filed

June 7, 2019

Patent Citations Received

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US Patent 11971598 Tray arrangements for cassettes

Patent Primary Examiner

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Ryan A Lepisto

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