Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10727119 Process integration approach of selective tungsten via fill

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Current Assignee
Applied Materials
Applied Materials
Date Filed
January 18, 2019
Date of Patent
July 28, 2020
Patent Applicant
Applied Materials
Applied Materials
Patent Application Number
16252100
Patent Citations
‌
US Patent 10157786 Selective formation of metallic films on metallic surfaces
‌
US Patent 10014213 Selective bottom-up metal feature filling for interconnects
‌
US Patent 10256144 Process integration approach of selective tungsten via fill
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10727119
Patent Primary Examiner
‌
Long Pham

Find more entities like US Patent 10727119 Process integration approach of selective tungsten via fill

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.