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US Patent 10727119 Process integration approach of selective tungsten via fill

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Patent

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Applied Materials

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10727119

Date of Patent

July 28, 2020

Patent Application Number

16252100

Date Filed

January 18, 2019

Patent Citations

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US Patent 10157786 Selective formation of metallic films on metallic surfaces

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US Patent 10014213 Selective bottom-up metal feature filling for interconnects

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US Patent 10256144 Process integration approach of selective tungsten via fill

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