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US Patent 10714822 Wireless module and method for manufacturing wireless module

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Edits on 21 May, 2023
"Remove website redirecting to Patent Public Search front page"
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Golden AI
edited on 21 May, 2023
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Infobox (-1 properties)
Infobox
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1071482200
Edits on 24 Apr, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 24 Apr, 2023
Edits on 3 Apr, 2023
"update citations for inverse infoboxes"
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edited on 3 Apr, 2023
Edits on 2 Apr, 2023
"update citations for inverse infoboxes"
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edited on 2 Apr, 2023
Edits on 29 Mar, 2023
"Entity importer update"
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edited on 29 Mar, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
‌
TAIYO YUDEN CO., LTD
0
Current Assignee
‌
TAIYO YUDEN CO., LTD
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
107148220
Date of Patent
July 14, 2020
0
Patent Application Number
158281780
Date Filed
November 30, 2017
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=107148220
Patent Citations
‌
US Patent 10163867 Semiconductor package and manufacturing method thereof
0
‌
US Patent 10256535 Selectively shielding radio frequency module with multi-layer antenna
0
‌
US Patent 10283859 Selective shielding of radio frequency modules
0
‌
US Patent 10581157 Antenna-integrated wireless module and method for manufacturing antenna-integrated wireless module
0
Patent Citations Received
‌
US Patent 10868364 Wireless module and method for manufacturing the same
0
‌
US Patent 11347273 Electronic device module, method of manufacturing the same and electronic apparatus
0
Patent Primary Examiner
‌
Ab Salam Alkassim, Jr.
0
"update citations for inverse infoboxes"
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Golden AI
edited on 29 Mar, 2023
Edits on 27 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 27 Sep, 2022
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
Golden AI profile picture
Golden AI
edited on 25 Sep, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 25 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
‌
TAIYO YUDEN CO., LTD
0
Current Assignee
‌
TAIYO YUDEN CO., LTD
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
107148220
Date of Patent
July 14, 2020
0
Patent Application Number
158281780
Date Filed
November 30, 2017
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=107148220
Patent Citations
‌
US Patent 10163867 Semiconductor package and manufacturing method thereof
0
‌
US Patent 10256535 Selectively shielding radio frequency module with multi-layer antenna
0
‌
US Patent 10283859 Selective shielding of radio frequency modules
0
‌
US Patent 10581157 Antenna-integrated wireless module and method for manufacturing antenna-integrated wireless module
0
Patent Citations Received
‌
US Patent 10868364 Wireless module and method for manufacturing the same
0
‌
US Patent 11347273 Electronic device module, method of manufacturing the same and electronic apparatus
0
Patent Primary Examiner
‌
Ab Salam Alkassim, Jr.
0
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 25 Sep, 2022
Edits on 8 Jun, 2022
"Entity importer update"
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Golden AI
edited on 8 Jun, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=10714822
Edits on 1 Jun, 2022
"update inverses"
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Golden AI
edited on 1 Jun, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 11347273 Electronic device module, method of manufacturing the same and electronic apparatus
Edits on 8 Feb, 2022
"update inverses"
Golden AI profile picture
Golden AI
edited on 8 Feb, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 10868364 Wireless module and method for manufacturing the same
Edits on 5 Feb, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 5 Feb, 2022
Edits made to:
Infobox (+13 properties)
‌

 US Patent 10714822 Wireless module and method for manufacturing wireless module

Infobox
Is a
Patent
Patent
Patent applicant
‌
TAIYO YUDEN CO., LTD
Current assignee
‌
TAIYO YUDEN CO., LTD
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10714822
Date of patent
July 14, 2020
Patent application number
15828178
Date Filed
November 30, 2017
Patent citations
‌
US Patent 10163867 Semiconductor package and manufacturing method thereof
‌
US Patent 10256535 Selectively shielding radio frequency module with multi-layer antenna
‌
US Patent 10283859 Selective shielding of radio frequency modules
‌
US Patent 10581157 Antenna-integrated wireless module and method for manufacturing antenna-integrated wireless module
Patent primary examiner
‌
Ab Salam Alkassim, Jr.

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