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US Patent 10615133 Die package with superposer substrate for passive components

Patent 10615133 was granted and assigned to Intel on April, 2020 by the United States Patent and Trademark Office.

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Golden AI
edited on 19 Sep, 2024
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Patent Citations Received
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US Patent 12094827 Size and efficiency of dies
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edited on 11 Sep, 2024
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US Patent 12087746 Microelectronic assemblies having an integrated capacitor
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US Patent 11961804 Size and efficiency of dies
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edited on 10 Apr, 2024
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US Patent 11955393 Structures for bonding elements including conductive interface features
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Edits on 4 Apr, 2024
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edited on 4 Apr, 2024
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US Patent 11948847 Bonded structures
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Edits on 27 Sep, 2023
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US Patent 11715695 Size and efficiency of dies
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Edits on 7 Jun, 2023
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edited on 7 Jun, 2023
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US Patent 11670615 Bonded structures
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Edits on 7 Apr, 2023
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edited on 7 Apr, 2023
Infobox
Patent Citations Received
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US Patent 11600542 Cavity packages
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Edits on 25 Mar, 2023
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edited on 25 Mar, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
Intel
Intel
0
Current Assignee
Intel
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
106151330
Date of Patent
April 7, 2020
0
Patent Application Number
149106060
Date Filed
September 27, 2013
0
Patent Citations Received
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US Patent 10886228 Improving size and efficiency of dies
0
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US Patent 11600542 Cavity packages
0
Patent Primary Examiner
‌
Benjamin P Sandvik
0
"update citations for inverse infoboxes"
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edited on 25 Mar, 2023
Edits on 8 Mar, 2023
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Golden AI
edited on 8 Mar, 2023
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
‌
US Patent 11600542 Cavity packages
0
Edits on 24 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 24 Sep, 2022
"Entity importer update"
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Golden AI
edited on 24 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
Intel
Intel
0
Current Assignee
Intel
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
106151330
Date of Patent
April 7, 2020
0
Patent Application Number
149106060
Date Filed
September 27, 2013
0
Patent Citations Received
‌
US Patent 10886228 Improving size and efficiency of dies
0
Patent Primary Examiner
‌
Benjamin P Sandvik
0
Edits on 9 Feb, 2022
"update inverses"
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Golden AI
edited on 9 Feb, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Patent citations received
‌
US Patent 10886228 Improving size and efficiency of dies
Edits on 2 Feb, 2022
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created this topic on 2 Feb, 2022
Edits made to:
Infobox (+9 properties)
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 US Patent 10615133 Die package with superposer substrate for passive components

Infobox
Is a
Patent
Patent
Patent applicant
Intel
Intel
Current assignee
Intel
Intel
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10615133
Date of patent
April 7, 2020
Patent application number
14910606
Date Filed
September 27, 2013
Patent primary examiner
‌
Benjamin P Sandvik

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