US Patent 10553485 Methods of producing fully self-aligned vias and contacts
Patent 10553485 was granted and assigned to Micromaterials, Inc on February, 2020 by the United States Patent and Trademark Office.
Currently, there are no issues on this topic.
Find more entities like US Patent 10553485 Methods of producing fully self-aligned vias and contacts
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
By using this site, you agree to our Terms of Service.