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US Patent 10541113 Chamber with flow-through source

Patent 10541113 was granted and assigned to Applied Materials on January, 2020 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Applied Materials
Applied Materials
Date Filed
March 4, 2019
Date of Patent
January 21, 2020
Patent Applicant
Applied Materials
Applied Materials
Patent Application Number
16291494
Patent Citations
‌
US Patent 10062578 Methods for etch of metal and metal-oxide films
‌
US Patent 10062579 Selective SiN lateral recess
‌
US Patent 10062585 Oxygen compatible plasma source
‌
US Patent 10062587 Pedestal with multi-zone temperature control and multiple purge capabilities
‌
US Patent 10083830 Substrate cleaning method for removing oxide film
‌
US Patent 10147620 Bolted wafer chuck thermal management systems and methods for wafer processing systems
‌
US Patent 10147736 Semiconductor memory device and method for manufacturing same
‌
US Patent 10224180 Chamber with flow-through source
‌
US Patent 10319739 Accommodating imperfectly aligned memory holes
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US Patent 10269541 Workpiece processing chamber having a thermal controlled microwave window
•••
Patent Citations Received
‌
US Patent 11697877 High temperature face plate for deposition application
0
‌
US Patent 11242600 High temperature face plate for deposition application
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10541113
Patent Primary Examiner
‌
David A. Vanore

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