US Patent 10529603 High pressure wafer processing systems and related methods
Patent 10529603 was granted and assigned to Micromaterials, Inc on January, 2020 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 4, 2019
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Date of Patent
January 7, 2020
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Patent Applicant
Patent Application Number
16292289
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Patent Citations
Patent Citations Received
•••
Patent Inventor Names
Sultan Malik
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Qiwei Liang
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Sean Kang
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Srinivas D. Nemani
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Venkata Ravishankar Kasibhotla
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Adib M. Khan
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Keith Tatseun Wong
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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