Patent 10394401 was granted and assigned to Fujikura on August, 2019 by the United States Patent and Trademark Office.
A wiring body includes: a first resin layer; an electrode layer on the first resin layer and formed by first conductor lines; a first lead wire layer on the first resin layer and formed by second conductor lines; and a boundary line interposed between the electrode layer and the first lead wire layer. The wiring body satisfies W1<W2 and L1>W3 where W1 represents a width of the first conductor lines in a direction orthogonal to an extending direction of the first conductor lines, W2 represents a width of the second conductor lines in a direction orthogonal to an extending direction of the second conductor lines, L1 represents a length of the boundary line in its extending direction, and W3 represents a width of the one end part of the first lead wire layer in a direction orthogonal to an extending direction of the first lead wire layer.