Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rui Chen0
Minghao Tang0
Yuping Ren0
Date of Patent
June 11, 2019
0Patent Application Number
158341510
Date Filed
December 7, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods of fabricating an interconnect structure. A first sacrificial layer is deposited over a dielectric layer, and a block mask is formed that covers an area on the first sacrificial layer. A second sacrificial layer is deposited over the block mask and the first sacrificial layer. After the block mask is formed, the second sacrificial layer is patterned to form a mandrel that is arranged in part on a portion of the block mask.
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