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US Patent 10283398 Substrate placing table

Patent 10283398 was granted and assigned to Tokyo Electron on May, 2019 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent

Patent attributes

Patent Applicant
Tokyo Electron
Tokyo Electron
Current Assignee
Tokyo Electron
Tokyo Electron
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10283398
Date of Patent
May 7, 2019
Patent Application Number
15521217
Date Filed
September 17, 2015
Patent Citations Received
‌
US Patent 11996294 Cryogenic atomic layer etch with noble gases
3
‌
US Patent 11373893 Cryogenic electrostatic chuck
‌
US Patent 11437261 Cryogenic electrostatic chuck
‌
US Patent 11515166 Cryogenic atomic layer etch with noble gases
‌
US Patent 11646183 Substrate support assembly with arc resistant coolant conduit
10
‌
US Patent 11764041 Adjustable thermal break in a substrate support
Patent Primary Examiner
‌
Tho V Duong
Patent abstract

A substrate placing table, which is installed inside a processing container for processing a wafer, includes: a stage configured to place a water on an upper surface thereof and including an inner peripheral flow channel and an outer peripheral flow channel formed therein to circulate a heat medium of a predetermined temperature therethrough; a support table configured to support the stage; and a temperature adjusting plate installed between the stage and the support table, and including a temperature adjusting mechanism configured to adjust a temperature of a heat radiation portion at which heat is radiated between the stage and the support table.

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