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US Patent 10269756 Die processing

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
March 26, 2018
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Date of Patent
April 23, 2019
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Patent Application Number
15936075
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Patent Citations Received
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US Patent 11515279 Low temperature bonded structures
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
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US Patent 11476213 Bonded structures without intervening adhesive
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US Patent 11515291 Integrated voltage regulator and passive components
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US Patent 11515202 3D IC method and device
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US Patent 12113056 Stacked dies and methods for forming bonded structures
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US Patent 12125784 Interconnect structures
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US Patent 12132020 Low temperature bonded structures
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US Patent 11462419 Microelectronic assemblies
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US Patent 10508030 Seal for microelectronic assembly
•••
Patent Inventor Names
Cyprian Emeka Uzoh
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10269756
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Patent Primary Examiner
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Anthony Ho
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