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US Patent 10236238 Semiconductor device

Patent 10236238 was granted and assigned to Sony on March, 2019 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Current Assignee
Sony
Sony
Date Filed
September 21, 2017
Date of Patent
March 19, 2019
Patent Applicant
Sony
Sony
Patent Application Number
15711607
Patent Citations Received
‌
US Patent 11990448 Direct bonding in microelectronic assemblies
0
‌
US Patent 11626356 Semiconductor device
‌
US Patent 11908817 Bonding structure of dies with dangling bonds
0
‌
US Patent 11923279 Semiconductor device
0
‌
US Patent 11587857 Semiconductor device
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10236238
Patent Primary Examiner
‌
Jarrett J Stark

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