Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10224224 High pressure wafer processing systems and related methods

Patent 10224224 was granted and assigned to Micromaterials, Inc on March, 2019 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Current Assignee
‌
Micromaterials, Inc
0
Date Filed
December 7, 2017
0
Date of Patent
March 5, 2019
0
Patent Applicant
‌
Micromaterials, Inc
0
Patent Application Number
15835356
0
Patent Citations Received
‌
US Patent 11881411 High pressure annealing process for metal containing materials
0
‌
US Patent 11469113 High pressure and high temperature anneal chamber
‌
US Patent 11527421 Gas delivery system for high pressure processing chamber
‌
US Patent 11581183 Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
‌
US Patent 11610773 Condenser system for high pressure processing system
0
‌
US Patent 11651990 Substrate processing apparatus and driving method thereof
0
‌
US Patent 11694912 High pressure and high temperature anneal chamber
0
‌
US Patent 11705337 Tungsten defluorination by high pressure treatment
0
‌
US Patent 11749555 Semiconductor processing system
‌
US Patent 11756803 Gas delivery system for high pressure processing chamber
•••
Patent Inventor Names
Srinivas D. Nemani
0
Keith Tatseun Wong
0
Qiwei Liang
0
Sean S. Kang
0
Sultan Malik
0
Venkata Ravishankar Kasibhotla
0
Adib Khan
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
10224224
0
Patent Primary Examiner
‌
William Coleman
0

Find more entities like US Patent 10224224 High pressure wafer processing systems and related methods

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.