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US Patent 10162139 Semicondcutor package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
July 27, 2017
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Date of Patent
December 25, 2018
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Patent Application Number
15660972
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Patent Citations Received
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US Patent 12124078 Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same
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US Patent 11493713 Photonic quantum computer assembly having dies with specific contact configuration and matched CTE
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US Patent 11368157 Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
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US Patent 11394386 Logic drive using standard commodity programmable logic IC chips
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US Patent 11404404 Semiconductor structure having photonic die and electronic die
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US Patent 11892693 Photonic quantum computer assembly
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US Patent 12085769 Integrated circuit device and method
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US Patent 12117660 Fiber optic connector
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US Patent 11493714 Quantum computing die assembly with thru-silicon vias and connected logic circuit
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US Patent 10481351 Semicondcutor packages
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•••
Patent Inventor Names
Hsing-Kuo Hsia
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Jeng-Shien Hsieh
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Chen-Hua Yu
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Chuei-Tang Wang
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10162139
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